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MURD620CTT4G - onsemi

Description: Low Leakage Mechanical Characteristics:; Low Forward Voltage Drop; Ultrafast 35 Nanosecond Recovery Time; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Marking: U620T; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; AEC-Q101 Qualified and PPAP Capable; NRVU Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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MURD620CTT4G Details

  • Manufacturer Part Number:

    MURD620CTT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Package Description:

    DPAK-3/2

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Mainland China, Malaysia, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.45

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    ULTRA FAST RECOVERY

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

MURD620CTT4G Frequently Asked Questions (FAQs)

  • A good layout should prioritize thermal dissipation by keeping the device away from heat sources, using thermal vias, and ensuring good copper pour coverage. Consult onsemi's application notes for specific guidance.
  • Implement proper thermal management, ensure good airflow, and consider using a heat sink. Also, ensure the device is operated within the recommended temperature range (−55°C to 150°C) and follow onsemi's derating guidelines.
  • Handle the device with ESD-protective equipment and follow proper handling procedures to prevent damage. The MURD620CTT4G has built-in ESD protection, but it's still important to follow standard ESD precautions during handling and assembly.
  • The MURD620CTT4G is a commercial-grade device, but onsemi offers other variants with enhanced reliability and screening for high-reliability applications. Consult onsemi's product portfolio and documentation for more information.
  • Follow onsemi's recommended soldering profiles and assembly guidelines to ensure reliable connections and minimize thermal stress. Consult the datasheet and application notes for specific guidance.

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MURD620CTT4G Overview

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For a full list of alternate parts for MURD620CTT4G, check out Findchips.com