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MURF1660CTG - onsemi

Description: Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; UL Recognized File #E69369 Mechanical Characteristics:; Epoxy Meets UL94, VO @ 1/8"; Current Derating @ Both Case and Ambient Temperatures; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Weight: 1.9 grams (approximately); Ultrafast 60 Nanosecond Recovery Times; Marking: U1660; Low Leakage Specified @ 150°C Case Temperature; High Temperature Glass Passivated Junction; Case: Epoxy, Molded; Electri

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Symbol
MURF1660CTG - onsemi - PCB symbol
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PCB Footprints
MURF1660CTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−220 FULLPAK CASE 221D−03 ISSUE K
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3D Models
MURF1660CTG - onsemi - 3D model - Transistor Outline, Vertical - TO−220 FULLPAK CASE 221D−03 ISSUE K
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MURF1660CTG Details

  • Manufacturer Part Number:

    MURF1660CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220 3 LEAD FULLPAK

  • Pin Count:

    3

  • Manufacturer Package Code:

    221D-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.06 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MURF1660CTG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux, and the PCB should be cleaned after soldering to prevent corrosion.
  • The MURF1660CTG has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.
  • Store the devices in their original packaging or in a dry, cool place. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the body, not the leads, to prevent damage.

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MURF1660CTG Overview

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For a full list of alternate parts for MURF1660CTG, check out Findchips.com