Description:Case: Epoxy, Molded; Weight: 1.9 grams (approximately); High Voltage Capability to 600 Volts; Low Leakage Specified @ 150 C Case Temperature; Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Current Derating @ Both Case and Ambient Temperatures Mechanical Characteristics:; 175 C Operating Junction Temperature; Shipped 50 units per plastic tube; Popular TO-220 Package; High Temperature Glass Passivated Junction; Ultrafast 35 Nanosecond Recovery Times; Finish: All External Surfaces Corrosio
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current rating at high temperatures.
The maximum allowed voltage transient is 1.5 times the maximum rated voltage (Vdrm) for a duration of ≤ 10 ms. Exceeding this may cause damage to the device.
Yes, but ensure that the devices are matched in terms of voltage and current ratings. Also, consider the current sharing and thermal management implications of parallel operation.
Use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
MURH860CTG Overview
Use the download button to access the MURH860CTG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MURH8,
or try a keyword search, such as Rectifier Diodes
