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MURS1JAL-TP - MCC

Description: • • Halogen Free. “Green” Device (Note 1) Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates Compliant. See Ordering Information) • Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1

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PCB Footprints
MURS1JAL-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC)
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3D Models
MURS1JAL-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC)
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MURS1JAL-TP Details

  • Manufacturer Part Number:

    MURS1JAL-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.4 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MURS1JAL-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MURS1JAL-TP is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.2 mm radius corner. The pad should be centered on the component and have a solder mask defined around it.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink. The device can operate up to 150°C, but it's recommended to keep the junction temperature below 125°C for reliable operation.
  • The maximum surge current rating for MURS1JAL-TP is 100 A for 10 ms. However, it's recommended to derate the surge current based on the operating temperature and other environmental factors.
  • While MURS1JAL-TP is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade, and additional filtering or shielding may be required to minimize electromagnetic interference (EMI).
  • To ensure reliability in a humid environment, apply a conformal coating to the device and follow proper PCB design and assembly guidelines. Additionally, consider using a moisture-resistant package or a hermetically sealed device for extreme humidity conditions.

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MURS1JAL-TP Overview

Use the download button to access the MURS1JAL-TP schematic symbol, PCB footprint, and 3D model.
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