MURS230T3G - onsemi
Description: Rectangular Package for Automated Handling; Marking: U2F, U2G; Case: Epoxy, Molded; Low Forward Voltage Drop (0.95 Volts Max @ 2.0 A, T J = 150°C) Mechanical Characteristics:; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Shipped in 12 mm Tape and Reel, 2500 units per reel; High Temperature Glass Passivated Junction; Weight: 95 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Small Compact Surface Moun
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