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MVF30NN151CKU26 - NXP

Description: MCU, Freescale, Vybrid, MVF30NN151CKU26 Freescale MVF30NN151CKU26, 32bit ARM Cortex A5 Microcontroller, 266MHz, 96 kB, 512 kB Boot ROM, 176-Pin LQFP

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Symbol
MVF30NN151CKU26 - NXP - PCB symbol
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PCB Footprints
MVF30NN151CKU26 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - HLQFP176
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3D Models
MVF30NN151CKU26 - NXP - 3D model - Quad Flat Packages - HLQFP176
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MVF30NN151CKU26 Details

  • Manufacturer Part Number:

    MVF30NN151CKU26

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-176

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    16

  • CPU Family:

    CORTEX-A5

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e3

  • Length:

    24 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    111

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1572864

  • ROM Programmability:

    FLASH

  • Speed:

    266 MHz

  • Supply Current-Max:

    850 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.23 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MVF30NN151CKU26 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11160, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • The MVF30NN151CKU26 requires a gate driver with a voltage rating of at least 15 V and a current rating of 2-3 A. NXP recommends using a gate driver like the UCC37322 or the MC33153. Ensure the gate driver is compatible with the MOSFET's gate capacitance and threshold voltage.
  • The maximum allowed voltage for Vds is 150 V, and for Vgs it is ±20 V. Exceeding these voltage limits can damage the MOSFET. Ensure proper voltage clamping and protection circuits are implemented in the design.
  • Use the MOSFET's thermal resistance (RθJA) and the maximum allowed junction temperature (Tj) to calculate the power dissipation. NXP provides a thermal model and calculation guidelines in the application note AN11160. You can also use online calculators or simulation tools like LTspice or PSpice.
  • The MVF30NN151CKU26 has an ESD rating of 2 kV (Human Body Model) and 150 V (Machine Model). Handle the device with ESD-protective equipment, and follow proper handling and storage procedures to prevent damage. NXP recommends using an ESD wrist strap or mat during assembly and testing.

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MVF30NN151CKU26 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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