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MVF51NN152CMK50 - NXP

Description: ARM® Cortex®-A5 Microprocessor IC Vybrid, VF5xx 1 Core, 32-Bit 500MHz 364-LFBGA (17x17)

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Symbol
MVF51NN152CMK50 - NXP - PCB symbol
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PCB Footprints
MVF51NN152CMK50 - NXP PCB footprint - BGA - BGA - SOT1517-1
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3D Models
MVF51NN152CMK50 - NXP - 3D model - BGA - SOT1517-1
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MVF51NN152CMK50 Details

  • Manufacturer Part Number:

    MVF51NN152CMK50

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-364

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7.1

  • Address Bus Width:

    16

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    24 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B364

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    64

  • Number of Serial I/Os:

    13

  • Number of Terminals:

    364

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA364,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    1572864

  • Seated Height-Max:

    1.5 mm

  • Speed:

    500 MHz

  • Supply Current-Max:

    850 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

MVF51NN152CMK50 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the application note AN12271. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • The IVR can be configured using the Power Management Controller (PMC) registers. Refer to the device's reference manual and the application note AN12271 for detailed information on IVR configuration and power management.
  • NXP provides guidelines for EMC and EMI considerations in the application note AN12271. It's essential to follow these guidelines to ensure compliance with regulatory requirements and to prevent electromagnetic interference.
  • NXP provides a secure boot and firmware update solution using the Device Lifecycle Management (DLM) and the Secure Bootloader (SBL). Refer to the device's reference manual and the application note AN12271 for detailed information on implementing secure boot and firmware updates.
  • The internal flash memory has limitations on endurance, retention, and programming cycles. Refer to the device's reference manual for detailed information on flash memory usage and limitations. It's essential to follow the recommended usage guidelines to ensure data integrity and prevent flash wear-out.

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MVF51NN152CMK50 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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