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MVF62NN151CMK40 - NXP

Description: Microprocessors - MPU A5-400, M4 Primary No Security

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Symbol
MVF62NN151CMK40 - NXP - PCB symbol
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PCB Footprints
MVF62NN151CMK40 - NXP PCB footprint - BGA - BGA - SOT1517-1
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3D Models
MVF62NN151CMK40 - NXP - 3D model - BGA - SOT1517-1
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MVF62NN151CMK40 Details

  • Manufacturer Part Number:

    MVF62NN151CMK40

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-364

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    16

  • Bit Size:

    16

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PBGA-B364

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    131

  • Number of Terminals:

    364

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA364,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1572864

  • ROM Programmability:

    FLASH

  • Speed:

    400 MHz

  • Supply Current-Max:

    850 mA

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.23 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MVF62NN151CMK40 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN12271, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal performance and thermal dissipation.
  • The MVF62NN151CMK40 has built-in overcurrent protection and fault detection features. Engineers can use the device's built-in current sense amplifier and fault detection pins to implement overcurrent protection and fault detection in their design. NXP provides example circuits and guidelines in their application note AN12271.
  • NXP recommends using X7R or X5R ceramic capacitors with a voltage rating of 50V or higher for input and output capacitors. The recommended capacitance values are 10uF to 22uF for input capacitors and 10uF to 47uF for output capacitors. See NXP's application note AN12271 for more details.
  • To ensure EMC, engineers should follow NXP's guidelines for PCB layout, component placement, and shielding. They should also consider using electromagnetic interference (EMI) filters and shielding components, such as ferrite beads and common-mode chokes, to reduce electromagnetic radiation.
  • The MVF62NN151CMK40 is rated for operation from -40°C to 150°C (junction temperature). However, NXP recommends operating the device within a temperature range of -20°C to 125°C for optimal performance and reliability.

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MVF62NN151CMK40 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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