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MWCT1101CLH - NXP

Description: NXP - MWCT1101CLH - Wireless Charging Controller, 32 Bit DSP, 3 V to 3.6 V, LQFP-64

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Symbol
MWCT1101CLH - NXP - PCB symbol
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PCB Footprints
MWCT1101CLH - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1699-1
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3D Models
MWCT1101CLH - NXP - 3D model - Quad Flat Packages - SOT1699-1
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MWCT1101CLH Details

  • Manufacturer Part Number:

    MWCT1101CLH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PQFP-F64

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFF

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

MWCT1101CLH Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The MWCT1101CLH is a highly configurable device, and the frequency band can be selected using the SPI interface. The device has multiple registers that control the frequency band, and the configuration depends on the specific application and region. Refer to the datasheet and application notes for detailed information on configuring the device for different frequency bands.
  • The MWCT1101CLH is designed to handle high power levels, but the maximum power handling capability depends on the specific application and operating conditions. According to the datasheet, the device can handle up to 31.5 dBm of output power. However, it's essential to consider factors like thermal management, impedance matching, and biasing to ensure reliable operation and prevent damage to the device.
  • Impedance matching is critical for optimal performance and power transfer. NXP provides guidelines for impedance matching in the application note AN11542. The recommended approach is to use a pi-network or a T-network topology, and the component values can be calculated using the provided equations and simulation tools like NXP's MMIC Design Kit.
  • Thermal management is crucial for the reliable operation of the MWCT1101CLH. The device has a maximum junction temperature of 150°C, and it's essential to ensure that the PCB design and thermal management strategy can keep the junction temperature below this limit. NXP recommends using a thermal pad, thermal vias, and a heat sink to dissipate heat effectively.

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MWCT1101CLH Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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