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MX25L25635FMI-10G - Macronix

Description: MX25L25635FMI-10G, Serial NOR Flash Memory, 128M x 2 bit, 256M x 1 bit, 64M x 4 bit 256Mbit, 2.7 → 3.6 V, 16-Pin

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MX25L25635FMI-10G - Macronix PCB footprint - Small Outline Packages - Small Outline Packages - SOP
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MX25L25635FMI-10G - Macronix  - 3D model - Small Outline Packages - SOP
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MX25L25635FMI-10G Details

  • Manufacturer Part Number:

    MX25L25635FMI-10G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Macronix International Co Ltd

  • YTEOL:

    4

  • Additional Feature:

    IT ALSO CONFIGURED AS 256M X 1

  • Alternate Memory Width:

    2

  • Clock Frequency-Max (fCLK):

    104 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.52 mm

  • Write Protection:

    HARDWARE/SOFTWARE

MX25L25635FMI-10G Frequently Asked Questions (FAQs)

  • The MX25L25635FMI-10G has a minimum of 100,000 erase cycles, but the actual number of cycles may vary depending on usage and environmental conditions.
  • The hold pin (HOLD#) should be pulled high during power-up and power-down sequences to prevent unwanted writes or erases. It's recommended to tie the HOLD# pin to VCC through a resistor to ensure it's high during power transitions.
  • The recommended clock frequency for the MX25L25635FMI-10G is up to 104 MHz, but it can operate at frequencies up to 133 MHz with some performance degradation.
  • To enter deep power-down mode, send the DPD command (B9h) followed by the CE# pin being driven low. The device will enter a low-power state, and the CE# pin must be driven high to exit DPD mode.
  • The WP# pin is a write-protect pin that prevents writes to the status register and the memory array when driven low. It's recommended to tie the WP# pin to VCC through a resistor to enable write protection.

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