MX25L3255EXCI-10G - Macronix

MX25L3255EXCI-10G Details

• Manufacturer Part Number:

  MX25L3255EXCI-10G

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  6 X 8 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, TFBGA-24

• Pin Count:

  24

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Factory Lead Time:

  10 Weeks

• Manufacturer:

  Macronix International Co Ltd

• YTEOL:

  4

• Additional Feature:

  CAN BE ORGNISED AS 32 MBIT X 1; 4 X 6 BALL ARRAY

• Alternate Memory Width:

  2

• Clock Frequency-Max (fCLK):

  104 MHz

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PBGA-B24

• Length:

  8 mm

• Memory Density:

  33554432 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  24

• Number of Words:

  4194304 words

• Number of Words Code:

  4000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  4MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  2.7 V

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Type:

  NOR TYPE

• Width:

  6 mm

• Write Protection:

  HARDWARE/SOFTWARE