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MX29GL256FDT2I-11G - Macronix

Description: NOR Flash Parallel 3.3V 256M-bit 32M x 8/16M x 16 110ns 56-Pin TSOP-I

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MX29GL256FDT2I-11G - Macronix PCB footprint - Small Outline Packages - Small Outline Packages - TSOP(1) 56L
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MX29GL256FDT2I-11G - Macronix  - 3D model - Small Outline Packages - TSOP(1) 56L
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MX29GL256FDT2I-11G Details

  • Manufacturer Part Number:

    MX29GL256FDT2I-11G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP1

  • Package Description:

    14 X 20 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-142, TSOP1-56

  • Pin Count:

    56

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Macronix International Co Ltd

  • YTEOL:

    4

  • Access Time-Max:

    110 ns

  • Alternate Memory Width:

    8

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • JESD-30 Code:

    R-PDSO-G56

  • Length:

    18.4 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Sectors/Size:

    256

  • Number of Terminals:

    56

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP56,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Page Size:

    8/16 words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    128K

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    14 mm

MX29GL256FDT2I-11G Frequently Asked Questions (FAQs)

  • The MX29GL256FDT2I-11G operates over a temperature range of -40°C to 85°C.
  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation.
  • The WP# signal is used to prevent accidental writes to the device. When WP# is low, the device is write-protected.
  • The MX29GL256FDT2I-11G is a 256Mbit (32M x 8) flash memory device, organized as 2048 blocks of 128K x 8 bits.
  • The typical programming time for the MX29GL256FDT2I-11G is 10-15 seconds for a full chip erase and program.

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MX29GL256FDT2I-11G Overview

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