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MX52LM04A11XSI - Macronix

Description: FLASH - NAND (MLC) Memory IC 32Gbit eMMC_5.1 200 MHz 153-LFBGA (11.5x13)

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PCB Footprints
MX52LM04A11XSI - Macronix PCB footprint - BGA - BGA - 153BGA.
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MX52LM04A11XSI - Macronix  - 3D model - BGA - 153BGA.
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MX52LM04A11XSI Details

  • Manufacturer Part Number:

    MX52LM04A11XSI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-153

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Macronix International Co Ltd

  • YTEOL:

    8

  • Clock Frequency-Max (fCLK):

    200 MHz

  • JESD-30 Code:

    R-PBGA-B153

  • Length:

    13 mm

  • Memory Density:

    34359738368 bit

  • Memory IC Type:

    eMMC

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    4294967296 words

  • Number of Words Code:

    4000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4GX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    EMMC 5.1

  • Standby Current-Max:

    0.00076 A

  • Supply Current-Max:

    0.045 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    MLC NAND TYPE

  • Width:

    11.5 mm

  • Write Protection:

    HARDWARE/SOFTWARE

MX52LM04A11XSI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MX52LM04A11XSI is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 125°C.
  • The MX52LM04A11XSI requires a specific power-up and power-down sequence to ensure proper operation. It's recommended to follow the sequence outlined in the datasheet, which involves ramping up the VCC supply voltage to the recommended operating range before applying the clock signal, and then powering down the device in the reverse order.
  • The MX52LM04A11XSI supports a maximum clock frequency of 166 MHz, as specified in the datasheet. However, it's essential to ensure that the device is operated within the recommended operating conditions and that the clock signal meets the specified timing requirements.
  • The MX52LM04A11XSI has a dedicated reset pin (RST) that can be used to reset the device. To implement the reset functionality, connect the RST pin to a logic high level for a minimum of 5 ns to initiate the reset sequence. The device will then reset and return to its default state.
  • The MX52LM04A11XSI has a latency of 5-7 clock cycles, depending on the operating frequency and access mode. This latency can affect system performance, especially in high-speed applications. To minimize the impact of latency, it's recommended to use the device's burst mode and optimize the system's memory access patterns.

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