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MX66UM2G45GXRI00 - Macronix

Description: NOR Flash Memory 2Gb 1.8V Octa I/O Serial 24-Pin BGA - Trays

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Symbol
MX66UM2G45GXRI00 - Macronix - PCB symbol
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PCB Footprints
MX66UM2G45GXRI00 - Macronix PCB footprint - BGA - BGA - CSP 24 BALL 6X8/6BALLX4BALL-2
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3D Models
MX66UM2G45GXRI00 - Macronix - 3D model - BGA - CSP 24 BALL 6X8/6BALLX4BALL-2
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MX66UM2G45GXRI00 Details

  • Manufacturer Part Number:

    MX66UM2G45GXRI00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Macronix International Co Ltd

  • YTEOL:

    6

  • Alternate Memory Width:

    1

  • Clock Frequency-Max (fCLK):

    133 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1.3 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    6 mm

MX66UM2G45GXRI00 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MX66UM2G45GXRI00 is -40°C to 85°C, but it can also operate in an extended temperature range of -40°C to 105°C with some performance degradation.
  • The power-up sequence for the MX66UM2G45GXRI00 is critical. It's recommended to power up the VCCQ pin first, followed by the VCC pin, and then the input signals. The power-down sequence should be reversed.
  • The maximum operating frequency for the MX66UM2G45GXRI00 is 166 MHz, but it can be overclocked to 200 MHz with some performance degradation and increased power consumption.
  • The MX66UM2G45GXRI00 requires careful timing implementation. It's essential to follow the datasheet's timing diagrams and ensure that the clock signal meets the specified rise and fall times, as well as the setup and hold times for the input signals.
  • The recommended PCB layout and routing for the MX66UM2G45GXRI00 involves keeping the signal traces short and direct, using a solid ground plane, and avoiding vias and layer changes near the device. It's also essential to follow the datasheet's guidelines for decoupling capacitors and power supply filtering.

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MX66UM2G45GXRI00 Overview

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