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N01S830BAT22IT - onsemi

Description: • Power Supply Range: 2.5 to 5.5 V • Very Low Typical Standby Current < 4 A at +85°C • Very Low Operating Current < 10 mA • Simple Serial Interface ♦ Single-bit SPI Access ♦ DUAL-bit and QUAD-bit SPI-like Access • Flexible Operating Modes ♦ Word Mode ♦ Page Mode ♦ Burst Mode (Full Array) • High Frequency Read and Write Operation ♦ Clock Frequency up to 20 MHz • Functional Options ♦ HOLD Pin for Pausing Operation ♦ VBAT Pin for Battery−Back up • Built-in Write Protection (CS High) • High Reli

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N01S830BAT22IT - onsemi - PCB symbol
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PCB Footprints
N01S830BAT22IT - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8 4.4x3 CASE 948AL ISSUE O-1
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N01S830BAT22IT - onsemi - 3D model - Small Outline Packages - TSSOP8 4.4x3 CASE 948AL ISSUE O-1
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N01S830BAT22IT Details

  • Manufacturer Part Number:

    N01S830BAT22IT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-8

  • Package Description:

    TSSOP-8

  • Manufacturer Package Code:

    948BJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    onsemi

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

N01S830BAT22IT Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • The N01S830BAT22IT has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the N01S830BAT22IT is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards. Consult with onsemi's application engineers for guidance.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check for proper power supply voltage, decoupling, and signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.

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