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N24S64BC4DYT3G - onsemi

Description: Supports Standard, Fast and Fast-Plus I2C Protocol; 1.7 V to 5.5 V Supply Voltage Range; 32-byte Page Write Buffer; Lockable Secure Data Page; User Programmable Device Address; User Programmable Write Protection; Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA); Low Power CMOS Technology; 1,000,000 Program/Erase Cycles; 40 Year Data Retention; Industrial Temperature Range: −40°C to +85°C; Ultra-thin 4-ball WLCSP Package; These Devices are Pb−Free, Halogen Free/BFR Free and are

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N24S64BC4DYT3G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.77x0.77x0.3
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N24S64BC4DYT3G - onsemi  - 3D model - BGA - WLCSP4, 0.77x0.77x0.3
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N24S64BC4DYT3G Details

  • Manufacturer Part Number:

    N24S64BC4DYT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567VX

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2018-08-13

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    IT ALSO OPERATES AT 0.4MHZ

  • Clock Frequency-Max (fCLK):

    1 MHz

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.77 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.3 mm

  • Serial Bus Type:

    I2C

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.77 mm

  • Write Cycle Time-Max (tWC):

    5 ms

N24S64BC4DYT3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended.
  • To ensure reliable data retention, it is recommended to follow the recommended power-up and power-down sequences, and to avoid power cycling during data retention periods.
  • For high-reliability applications, it is recommended to follow the recommended burn-in and screening procedures, and to consider using a radiation-tolerant version of the device if necessary.
  • The POR circuitry is designed to reset the device during power-up. It is recommended to ensure that the power supply is stable and within the recommended voltage range before accessing the device.
  • For high-temperature environments, it is recommended to follow the recommended operating temperature range and to consider using a thermal interface material to improve heat dissipation.

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