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N25S830HAS22I - onsemi

Description: 2.7 to 3.6 V power supply range ; Very low standby current - typical Isb as low as 1 uA; Very low operating current - as low as 3 mA; Simple memory control: single chip select (CS), serial input (SI) and serial output (SO); Flexible operating modes: word read and write, page mode (32 word page), and burst mode (full array); 32 K x 8 bit organization ; Self timed write cycles; Built-in write protection (CS high); HOLD pin for pausing communication

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N25S830HAS22I - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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N25S830HAS22I - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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N25S830HAS22I Details

  • Manufacturer Part Number:

    N25S830HAS22I

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    0.150 INCH, GREEN, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751AZ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Clock Frequency-Max (fCLK):

    20 MHz

  • I/O Type:

    SEPARATE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1, (3 LINE)

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.000004 A

  • Standby Voltage-Min:

    2.7 V

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.91 mm

N25S830HAS22I Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • The power-up sequence for the N25S830HAS22I should follow the recommended sequence in the datasheet: VCC first, then VPP, and finally the input signals. This ensures proper device operation and prevents latch-up or damage.
  • The maximum allowed voltage on the input pins is VCC + 0.5V. Exceeding this voltage can cause damage to the device or affect its reliability.
  • The optimal value for CO depends on the specific application and requirements. A general guideline is to use a value between 1uF to 10uF, with a higher value providing better filtering but increasing the output stage's settling time.
  • The recommended operating temperature range for the N25S830HAS22I is -40°C to +125°C. Operating outside this range can affect the device's performance, reliability, or even cause damage.

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