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NB3H83905CDTG - onsemi

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NB3H83905CDTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-16 CASE 948F ISSUE B
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NB3H83905CDTG - onsemi  - 3D model - Small Outline Packages - TSSOP-16 CASE 948F ISSUE B
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NB3H83905CDTG Details

  • Manufacturer Part Number:

    NB3H83905CDTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-16

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    948F-01

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

NB3H83905CDTG Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for NB3H83905CDTG is 1.71V to 1.89V.
  • To ensure signal integrity, use a low-impedance PCB design, keep signal traces short, and use termination resistors as needed. Additionally, consider using a signal integrity analysis tool to simulate and optimize your design.
  • The maximum clock frequency supported by NB3H83905CDTG is 250 MHz.
  • When using NB3H83905CDTG in a multi-voltage system, ensure that the power supplies are sequenced correctly to prevent damage to the device. Typically, the core voltage (VCC) should be powered up before the input/output voltage (VCCIO).
  • For thermal management, use a heat sink or a thermal pad on the exposed pad of the QFN package. Ensure good airflow and consider using thermal interface materials to improve heat transfer.

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NB3H83905CDTG Overview

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