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NB6L11SMNG - onsemi

Description: Input Clock Frequency > 2.0GHz; Input Data Rate > 2.5Gb/s; 1 ps Maximum RMS Clock Jitter; Typically 10 ps of Data Dependent Jitter; 380 ps Typical Propagation Delay; 120 ps Typical Rise and Fall Times; Single Power Supply Vcc=2.5V ± 5%; Pb-Free

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PCB Footprints
NB6L11SMNG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16 3x3, 0.5P CASE 485G ISSUE G
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3D Models
NB6L11SMNG - onsemi  - 3D model - Quad Flat No-Lead - QFN16 3x3, 0.5P CASE 485G ISSUE G
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NB6L11SMNG Details

  • Manufacturer Part Number:

    NB6L11SMNG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN16, 3x3, 0.5P

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    485G-01

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.05

  • Family:

    6L

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    45 mA

  • Prop. Delay@Nom-Sup:

    0.45 ns

  • Propagation Delay (tpd):

    0.45 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NB6L11SMNG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, or thermal vias to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI and RFI. Ensure that the PCB layout and component selection are optimized for high-speed signal integrity.
  • Use a power supply with a high current capability and a soft-start circuit to limit inrush current. Consider using a power sequencing controller to manage power-up and power-down sequences.
  • Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Ensure the heat sink is securely attached using a suitable attachment method, such as screws or thermal tape.

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NB6L11SMNG Overview

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Part Image NB6L11SMNR2G onsemi

Low Skew Clock Driver, 6L Series, 2 True Output(s), 0 Inverted Output(s), QCC16