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NB7L585MNR4G - onsemi

Description: Maximum Input Data Rate > 8 Gb/s; Data Dependent Jitter < 15 ps; Maximum Input Clock Frequency > 5 GHz; Random Clock Jitter < 0.8 ps RMS; Low Skew 1:6 LVPECL Outputs, 20 ps max; 2:1 MultiLevel Mux Inputs; 175 ps Typical Propagation Delay; 55 ps Typical Rise and Fall Times; Differential LVPECL Outputs, 800 mV peaktopeak, typical; Internal 50-ohm Input Termination Resistors; VREFAC Reference Output; -40°C to +85°C Ambient Operating Temperature

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PCB Footprints
NB7L585MNR4G - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN32 5x5, 0.5P CASE 488AM
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NB7L585MNR4G - onsemi  - 3D model - Quad Flat No-Lead - QFN32 5x5, 0.5P CASE 488AM
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NB7L585MNR4G Details

  • Manufacturer Part Number:

    NB7L585MNR4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN32, 5x5, 0.5P, 3.1x3.1EP

  • Package Description:

    QFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    488AM

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Additional Feature:

    ALSO OPERATES AT 3.3 V

  • Family:

    7L

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    225 mA

  • Prop. Delay@Nom-Sup:

    0.3 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • fmax-Min:

    5000 MHz

NB7L585MNR4G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB7L585MNR4G involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down of the NB7L585MNR4G, it is recommended to follow a controlled power-up sequence, where the input voltage is ramped up slowly (e.g., 1-2 ms) to prevent inrush currents. Similarly, during power-down, the input voltage should be ramped down slowly to prevent voltage overshoots.
  • The NB7L585MNR4G is rated for operation from -40°C to 125°C, but it is recommended to derate the device's performance at higher temperatures to ensure reliability and prevent thermal shutdown.
  • The NB7L585MNR4G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
  • The recommended input capacitance value for the NB7L585MNR4G is 10-22 μF, depending on the specific application and operating frequency. A larger input capacitance can help improve the device's power supply rejection ratio (PSRR).

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NB7L585MNR4G Overview

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