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NCD57090ADWR2G - onsemi

Description: High Peak Output Current (+6.5 A/-6.5 A); Short Propagation Delays with Accurate Matching; High Transient & Electromagnetic Immunity; 5 KVrms On-Chip Galvanic Isolation; Wide Bias Voltage Ranges and Input Voltage Range; Active Miller Clamp or Negative Gate Voltage or Split Outputs

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NCD57090ADWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 WB
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NCD57090ADWR2G - onsemi  - 3D model - Small Outline Packages - SOIC8 WB
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NCD57090ADWR2G Details

  • Manufacturer Part Number:

    NCD57090ADWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC8 WB

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EW

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8.38

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    6.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    12.4 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    5.85 mm

NCD57090ADWR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for airflow.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range.
  • While the device is not specifically designed for high-humidity environments, it can still be used with proper precautions. Apply a conformal coating, use a moisture-resistant package, and ensure good PCB design practices to minimize the risk of moisture-related issues.
  • The device has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. Use an ESD wrist strap, mat, or workstation, and handle the device by the body or pins, rather than the leads.

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NCD57090ADWR2G Overview

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