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NCD57090CDWR2G - onsemi

Description: High Peak Output Current (+6.5 A/-6.5 A); Short Propagation Delays with Accurate Matching; High Transient & Electromagnetic Immunity; 5 KVrms On-Chip Galvanic Isolation; Wide Bias Voltage Ranges and Input Voltage Range; Active Miller Clamp or Negative Gate Voltage or Split Outputs

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NCD57090CDWR2G - onsemi - PCB symbol
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PCB Footprints
NCD57090CDWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 WB CASE 751EW ISSUE A
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3D Models
NCD57090CDWR2G - onsemi - 3D model - Small Outline Packages - SOIC8 WB CASE 751EW ISSUE A
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NCD57090CDWR2G Details

  • Manufacturer Part Number:

    NCD57090CDWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC8 WB

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EW

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8.38

  • High Side Driver:

    YES

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    6.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    12.4 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    5.85 mm

NCD57090CDWR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the specified voltage, current, and temperature ranges.
  • To troubleshoot issues related to the OTP feature, check the device's thermal design, ensure that the thermal interface material is properly applied, and verify that the device is not operating beyond its recommended power dissipation. Also, check for any signs of thermal runaway or overheating.
  • The recommended soldering and assembly guidelines for this device involve following the JEDEC J-STD-020 standard for reflow soldering, using a suitable solder paste, and ensuring that the device is properly aligned and secured during the assembly process.

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NCD57090CDWR2G Overview

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