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NCL30125A2DR2G - onsemi

Description: Dynamic Self Supply (DSS); Auto-recovery or Latch option; Internal 700 V high side gate driver; Skip cycle mode; Internal 700 V HV startup current source; Frequency Jittering; 35 V wide VCC operation; Adjustable operating frequency & soft start duration; Optional features (Skip threshold, BO level, OCP timer & etc.); Brown-out, OCP(SCP/OLP), VCC OVP, TSD; Dedicated Fault pin for OVP or OTP detection

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NCL30125A2DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 NB MISSING PINS 2 AND 13 CASE 751DU ISSUE O
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NCL30125A2DR2G - onsemi  - 3D model - Small Outline Packages - SOIC−16 NB MISSING PINS 2 AND 13 CASE 751DU ISSUE O
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NCL30125A2DR2G Details

  • Manufacturer Part Number:

    NCL30125A2DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC-16 NB

  • Manufacturer Package Code:

    751DU

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2019-11-15

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14/16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    300 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

NCL30125A2DR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power rating according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the NCL30125A2DR2G involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and a peak reflow temperature of 240°C (464°F) for 20-30 seconds. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F).
  • To troubleshoot issues related to the device's overcurrent protection feature, check the input voltage, output current, and sense resistor values to ensure they are within the recommended specifications. Also, verify that the device is not overheating, and check for any signs of physical damage or electrical overstress.
  • The recommended input and output capacitors for the NCL30125A2DR2G involve using low-ESR capacitors with a voltage rating of at least 1.5 times the input voltage. A 10uF to 22uF input capacitor and a 10uF to 47uF output capacitor are recommended, depending on the specific application requirements.

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NCL30125A2DR2G Overview

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