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NCL30170ADR2G - onsemi

Description: Accurate LED CC regulation: <±1%; Workable for Constant Power regulation; Selectable LED Channel counts; High PF & Low THD : >0.99 / <10%; Proprietary Active Phase-Cut Dimmer Control Technique; Wide Analog Dimming range: 5~100%; HV Startup Current Source; Protections - Input Over Voltage Protection - RCS Short Protection - Thermal Shutdown

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NCL30170ADR2G - onsemi - PCB symbol
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NCL30170ADR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - NCL30170ADR2G
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NCL30170ADR2G Details

  • Manufacturer Part Number:

    NCL30170ADR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-10

  • Manufacturer Package Code:

    751EE

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP10,.25,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage-Max:

    20.5 V

  • Supply Voltage-Min:

    19.5 V

  • Supply Voltage-Nom:

    20 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.9 mm

NCL30170ADR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The NCL30170ADR2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the NCL30170ADR2G is suitable for high-reliability and automotive applications. However, it's essential to review the device's AEC-Q100 qualification and to consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
  • Follow the recommended soldering temperature profile and handling procedures to prevent damage. It's also essential to ensure proper cleaning and drying of the PCB to prevent moisture-related issues.

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NCL30170ADR2G Overview

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