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NCP110AFCT100T2G - onsemi

Description: Low Vin 1.1 V; Ultra Low Noise 8.8 µVrms; Low Quiescent current 20 µA; High PSRR 95 dB at 1 kHz; Available in Small Packages CSP4 0.65 x 0.65 mm & xDFN4 1 x 1 mm

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Symbol
NCP110AFCT100T2G - onsemi - PCB symbol
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PCB Footprints
NCP110AFCT100T2G - onsemi PCB footprint - BGA - BGA - XDFN4 1.0x1.0, 0.65P
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3D Models
NCP110AFCT100T2G - onsemi - 3D model - BGA - XDFN4 1.0x1.0, 0.65P
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NCP110AFCT100T2G Details

  • Manufacturer Part Number:

    NCP110AFCT100T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567VS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-07-23

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.5 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.0008%

  • Load Regulation-Max:

    0.00199%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    1.03 V

  • Output Voltage1-Min:

    0.97 V

  • Output Voltage1-Nom:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    0.64 mm

NCP110AFCT100T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP110AFCT100T2G should prioritize thermal management, with a solid ground plane and thermal vias to dissipate heat. The input and output capacitors should be placed close to the device, and the feedback network should be routed to minimize noise and parasitic inductance.
  • To ensure stability, follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, verify that the output capacitor has a low ESR and is properly sized for the output voltage and current. A minimum of 10uF output capacitance is recommended.
  • The maximum ambient temperature for reliable operation of the NCP110AFCT100T2G is 85°C. However, the device can operate up to 150°C junction temperature, but with derated performance and reduced reliability.
  • Yes, the NCP110AFCT100T2G is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive grade devices and is suitable for use in harsh environments.
  • To troubleshoot issues with the NCP110AFCT100T2G, start by verifying the PCB layout and component values against the datasheet recommendations. Check for signs of overheating, and ensure that the input and output capacitors are properly sized and placed. Use an oscilloscope to measure the output voltage and current, and look for signs of oscillation or instability.

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NCP110AFCT100T2G Overview

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