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NCP110AFCT180T2G - onsemi

Description: Low Vin 1.1 V; Ultra Low Noise 8.8 µVrms; Low Quiescent current 20 µA; High PSRR 95 dB at 1 kHz; Available in Small Packages CSP4 0.65 x 0.65 mm & xDFN4 1 x 1 mm

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PCB Footprints
NCP110AFCT180T2G - onsemi PCB footprint - BGA - BGA - XDFN4 1.0x1.0, 0.65P
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NCP110AFCT180T2G - onsemi  - 3D model - BGA - XDFN4 1.0x1.0, 0.65P
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NCP110AFCT180T2G Details

  • Manufacturer Part Number:

    NCP110AFCT180T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567VS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-10-30

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.12 V

  • Dropout Voltage1-Nom:

    0.065 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e3

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.001152%

  • Load Regulation-Max:

    0.003582%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP110AFCT180T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range.
  • When selecting an input capacitor, consider the voltage rating, capacitance value, and ESR (Equivalent Series Resistance). A low-ESR capacitor with a voltage rating higher than the maximum input voltage is recommended.
  • For EMI filtering, consider using a pi-filter (C-L-C) or a common-mode choke to reduce electromagnetic interference. Ensure the filter components are rated for the maximum input voltage and current.

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