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NCP114ASN080T1G - onsemi

Description: Low Dropout: 135 mV Typical at 300 mA; High PSRR 75dB at 1kHz; Thermal Shutdown and Current Limit Protections; Very Low Quiescent Current of Typ. 50 µ?A; Available in uDFN 1.0 x 1.0 mm Package; +/- 1% typical Vout Accuracy ; Operating Input Voltage Range: 1.7 V to 5.5 V

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PCB Footprints
NCP114ASN080T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE 483
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NCP114ASN080T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP−5 CASE 483
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NCP114ASN080T1G Details

  • Manufacturer Part Number:

    NCP114ASN080T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.7 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.00336%

  • Load Regulation-Max:

    0.045%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    0.84 V

  • Output Voltage1-Min:

    0.76 V

  • Output Voltage1-Nom:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    5%

  • Width:

    1.5 mm

NCP114ASN080T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device is operated within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues related to overvoltage protection (OVP) and undervoltage protection (UVP), check the input voltage levels, ensure that the device is properly configured, and verify that the protection thresholds are set correctly. Also, check for any external components that may be affecting the device's operation.
  • When designing with the NCP114ASN080T1G, consider using EMI and RFI filters to minimize electromagnetic interference and radio-frequency interference. This can include using ferrite beads, capacitors, and resistors to filter out unwanted signals and ensure reliable operation.

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