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NCP115ASN150T2G - onsemi

Description: Operating Input Voltage Range: 1.7 V to 5.5 V; Low Dropout: 250 mV Typical at 300 mA @ 2.8 V; High PSRR 70dB at 1kHz; Thermal Shutdown and Current Limit Protections; Very Low Quiescent Current of Typ. 50 µA; Available in XDFN4 1.0 x 1.0 mm Package; +/- 1% typical Vout Accuracy @25 °C; Available in Fixed Voltage Options: 0.8 V to 3.6 V; Available in TSOP5 Package

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Symbol
NCP115ASN150T2G - onsemi - PCB symbol
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PCB Footprints
NCP115ASN150T2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - NCP115ASN150T2G-1
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3D Models
NCP115ASN150T2G - onsemi - 3D model - SOT23 (5-Pin) - NCP115ASN150T2G-1
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NCP115ASN150T2G Details

  • Manufacturer Part Number:

    NCP115ASN150T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-08-06

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.7 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.00525%

  • Load Regulation-Max:

    0.045%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.54 V

  • Output Voltage1-Min:

    1.46 V

  • Output Voltage1-Nom:

    1.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2.66%

  • Width:

    1.5 mm

NCP115ASN150T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good thermal conduction to the surrounding air. A minimum of 2oz copper thickness is recommended. Refer to the onsemi application note AND8327/D for more details.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and PCB layout. Additionally, ensure that the device is operated within its specified temperature range and that the junction temperature (Tj) does not exceed 150°C.
  • The NCP115ASN150T2G can withstand voltage transients up to 200V for a duration of 100ms, as per the ISO 7637-2 standard. However, it is recommended to use a TVS diode or other protection devices to limit voltage transients and ensure reliable operation.
  • Yes, the NCP115ASN150T2G is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications. However, it is essential to follow the recommended design guidelines, testing, and validation procedures to ensure the device meets the specific requirements of the application.
  • The power dissipation of the NCP115ASN150T2G can be calculated using the formula: Pd = (Vin - Vout) x Iout x η, where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and η is the efficiency of the device. Refer to the datasheet for more information on efficiency and thermal characteristics.

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