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NCP1239JD65R2G - onsemi

Description: 64-ms timer-based short-circuit protection with auto-recovery or latched operation; Pre-short ready; Latched OVP on Vcc (NCP1239 A & B versions); Latched OVP/OTP input for improved robustness; 35-V Vcc operation ; +500 mA/ -500 mA peak source/sink drive capability; Internal thermal shutdown; Extremely low no-load standby power; Pin-to-pin compatible with the existing NCP1236/1247 series; Fixed-frequency 65-kHz or 100-kHz current-mode control operation; Frequency foldback down to 26 kHz and skip mode; Adjust

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NCP1239JD65R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC
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NCP1239JD65R2G Details

  • Manufacturer Part Number:

    NCP1239JD65R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC-7

  • Package Description:

    SOIC-8/7

  • Manufacturer Package Code:

    751U

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2017-11-03

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Additional Feature:

    ALSO CONTAIN frequency modulation

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT/VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    35 V

  • Input Voltage-Min:

    9.4 V

  • Input Voltage-Nom:

    11 V

  • JESD-30 Code:

    R-PDSO-G7

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP7/8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    70 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1239JD65R2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1239JD65R2G should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern around the device. A minimum of 2oz copper thickness is recommended. Additionally, placing the device near a heat sink or using a thermal interface material can improve thermal performance.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power-up and power-down sequences. The input voltage should be ramped up and down slowly (typically 10-20 ms) to prevent inrush currents and voltage overshoots. Additionally, the enable pin should be driven high or low slowly (typically 1-10 ms) to prevent unwanted switching.
  • Operating the NCP1239JD65R2G beyond the recommended operating temperature range (–40°C to +150°C) can lead to reduced reliability, decreased performance, and potentially even device failure. The device may experience increased power consumption, reduced efficiency, and increased thermal stress, which can cause permanent damage.
  • To troubleshoot OCP issues, first, verify that the OCP threshold is set correctly and that the sense resistor is properly connected. Check for any short circuits or excessive current draws on the output. Ensure that the device is properly cooled, and the thermal shutdown is not triggered. If the issue persists, consult the datasheet and application notes for further guidance.
  • To minimize EMI and EMC issues, follow proper PCB layout practices, such as separating high-frequency and low-frequency circuits, using shielding, and implementing filtering. Ensure that the device is properly decoupled, and the input and output capacitors are selected to minimize noise. Additionally, consider using a common-mode choke or ferrite bead to reduce conducted emissions.

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