NCP12400EAHBB0DR2G footprint, schematic symbol and 3D model by onsemi

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NCP12400EAHBB0DR2G - onsemi PCB footprint - Other - Other - NCP12400EAHBB0DR2G-3

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Part Number NCP12400EAHBB0DR2G
Manufacturer onsemi
Pin Count 7
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - NCP12400EAHBB0DR2G-3
Released Date Mar 14, 2023
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

NCP12400EAHBB0DR2G Details

Manufacturer Part Number:
NCP12400EAHBB0DR2G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOIC-7
Package Description:
SOIC-8/7
Manufacturer Package Code:
751U
Country Of Origin:
Philippines
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
22 Weeks
Date Of Intro:
2018-09-13
Manufacturer:
onsemi
YTEOL:
7
Analog IC - Other Type:
SWITCHING CONTROLLER
Control Mode:
CURRENT-MODE
Control Technique:
PULSE SKIP MODE
Input Voltage-Max:
28 V
Input Voltage-Min:
9.3 V
Input Voltage-Nom:
11 V
JESD-30 Code:
R-PDSO-G7
JESD-609 Code:
e3
Length:
4.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
7
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP7/8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.75 mm
Supply Current-Max (Isup):
3.4 mA
Supply Voltage-Nom (Vsup):
11 V
Surface Mount:
YES
Switcher Configuration:
BUCK-BOOST
Switching Frequency-Max:
69 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.9 mm

NCP12400EAHBB0DR2G Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A minimum of 2oz copper thickness is recommended for the thermal pad.
To ensure reliable start-up in noisy environments, it is recommended to add a soft-start circuit to limit the inrush current and reduce electromagnetic interference (EMI). Additionally, using a high-quality input filter and ensuring good PCB layout practices can help minimize noise susceptibility.
A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. This helps to reduce voltage ripple and improve overall converter performance.
To optimize the output filter design, it is recommended to use a low-ESR output capacitor with a value of 10uF to 22uF, and a series inductor with a value of 1uH to 10uH. The output filter should be designed to resonate at a frequency above the switching frequency to minimize output voltage ripple.
For high-power applications, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W, and to ensure good thermal interface material (TIM) between the device and the heat sink. Additionally, forced air cooling or liquid cooling may be necessary for very high-power applications.

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NCP12400EAHBB0DR2G Overview

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