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NCP1252DDR2G - onsemi

Description: Peak current mode control; Adjustable switching frequency; Latched primary overcurrent protection with 10 ms fixed delay; Adjustable soft start timer; Auto recovery brown out detection; Extended Vcc range up to 28 V with auto recovery UVLO; Internal 160 ns leading edge blanking; Frequency jittering; Adjustable internal ramp compensation ; +500 mA / -800 mA Source/Sink current driver capability; Skip cycle operation in light/no load operation; SOIC-8 package

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NCP1252DDR2G - onsemi - PCB symbol
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PCB Footprints
NCP1252DDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NCP1252DDR2G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NCP1252DDR2G Details

  • Manufacturer Part Number:

    NCP1252DDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.55 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    500 kHz

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1252DDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1252DDR2G involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-current paths short and wide. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The input capacitor should have a low ESR and be rated for the maximum input voltage. A ceramic capacitor with an X7R or X5R dielectric is recommended. The output capacitor should have a low ESR and be rated for the maximum output voltage. A ceramic capacitor with an X7R or X5R dielectric is recommended. The capacitance value should be chosen based on the output voltage ripple requirement.
  • The maximum ambient temperature range for the NCP1252DDR2G is -40°C to 125°C. However, the device can operate up to 150°C with derating.
  • The power dissipation of the NCP1252DDR2G can be calculated using the following formula: Pd = (VIN x IIN) - (VOUT x IOUT). Where Pd is the power dissipation, VIN is the input voltage, IIN is the input current, VOUT is the output voltage, and IOUT is the output current.
  • The recommended input voltage range for the NCP1252DDR2G is 4.5V to 18V. However, the device can operate with an input voltage as low as 4V and as high as 20V with reduced performance.

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NCP1252DDR2G Overview

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