NCP1343AMDCDBD1R2G footprint, schematic symbol and 3D model by onsemi

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NCP1343AMDCDBD1R2G - onsemi PCB footprint - Other - Other - SOIC−9 NB CASE 751BP ISSUE A_2024

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Part Number NCP1343AMDCDBD1R2G
Manufacturer onsemi
Pin Count 9
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - SOIC−9 NB CASE 751BP ISSUE A_2024
Released Date Aug 27, 2024
Last Modified Date Jan 22, 2025 4:53 PM UTC
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NCP1343AMDCDBD1R2G Details

Manufacturer Part Number:
NCP1343AMDCDBD1R2G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Not Recommended
Part Package Code:
SOIC-9 NB
Package Description:
SOIC-10/9
Manufacturer Package Code:
751BP
Country Of Origin:
Thailand
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
onsemi
YTEOL:
3
Analog IC - Other Type:
SWITCHING CONTROLLER
Control Mode:
CURRENT-MODE
Control Technique:
RESONANT CONTROL
Input Voltage-Max:
28 V
Input Voltage-Min:
9 V
Input Voltage-Nom:
12 V
JESD-30 Code:
R-PDSO-G9
JESD-609 Code:
e3
Length:
4.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
9
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Equivalence Code:
SOP9/10,.25,40
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
2 mm
Supply Current-Max (Isup):
1.5 mA
Surface Mount:
YES
Switcher Configuration:
BUCK-BOOST
Switching Frequency-Max:
560 kHz
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
1 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.9 mm

NCP1343AMDCDBD1R2G Frequently Asked Questions (FAQs)

A good PCB layout for the NCP1343AMDCDBD1R2G should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern around the device. A minimum of 2oz copper thickness is recommended. Refer to onsemi's application note AND8325/D for more details.
To ensure reliable start-up and operation with a wide input voltage range, it's essential to follow the recommended input capacitor selection and voltage ramp-up time guidelines. A minimum input capacitance of 10uF is recommended, and the voltage ramp-up time should be slower than 10mV/us. Additionally, ensure that the input voltage does not exceed the maximum rating during start-up.
The maximum allowed output capacitance for stable operation of the NCP1343AMDCDBD1R2G is 100uF. Exceeding this value may lead to instability or oscillations. It's essential to follow the recommended output capacitor selection guidelines to ensure stable operation.
To optimize the design for low standby power consumption, ensure that the enable pin (EN) is properly connected to a logic signal, and the device is fully disabled during shutdown. Additionally, minimize the input voltage and use a low-quiescent-current regulator. Follow onsemi's application note AND8325/D for more details on low-standby-power design considerations.
For high-power applications, it's essential to consider thermal design carefully. Ensure good airflow around the device, and use a heat sink with a thermal resistance of less than 10°C/W. The maximum junction temperature (Tj) should not exceed 150°C. Follow onsemi's application note AND8325/D for more details on thermal design considerations.

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