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NCP137AFCTC110T2G - onsemi

Description: Ultra-Low Dropout of Typ. 40mV; Adjustable Voltage version; 40 mV typical dropout at the full 700 mA load.; Guaranteed Output Current from 0mA to 700mA; 0.5% Typical Output Voltage Accuracy; Output Current in Excess of 700mA; Output Active Discharge option available

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PCB Footprints
NCP137AFCTC110T2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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NCP137AFCTC110T2G - onsemi  - 3D model - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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NCP137AFCTC110T2G Details

  • Manufacturer Part Number:

    NCP137AFCTC110T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-09-26

  • Manufacturer:

    onsemi

  • YTEOL:

    9.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.06 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.4 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Line Regulation-Max:

    0.000451%

  • Load Regulation-Max:

    0.0015%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.7 A

  • Output Voltage1-Max:

    1.111 V

  • Output Voltage1-Min:

    1.089 V

  • Output Voltage1-Nom:

    1.1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1%

  • Width:

    0.8 mm

NCP137AFCTC110T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with multiple vias to the ground plane, and using a large copper area on the top and bottom layers to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, the device should be operated within the specified temperature range and derated accordingly.
  • The maximum allowed voltage on the VIN pin is 28V, although the recommended operating voltage range is 7V to 18V. Exceeding the maximum voltage can cause damage to the device.
  • To troubleshoot issues with the device not turning on, check the input voltage, ensure that the enable pin is properly biased, and verify that the output voltage is not shorted to ground. Also, check for any damage to the device or the PCB.
  • The recommended input capacitor value is 10uF to 22uF, and the type should be a low-ESR ceramic or film capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ripple.

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