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NCP137AFCTCADJT2G - onsemi

Description: Ultra-Low Dropout of Typ. 40mV; Adjustable Voltage version; 40 mV typical dropout at the full 700 mA load.; Guaranteed Output Current from 0mA to 700mA; 0.5% Typical Output Voltage Accuracy; Output Current in Excess of 700mA; Output Active Discharge option available

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NCP137AFCTCADJT2G - onsemi PCB footprint - BGA - BGA - NCP137AFCTCADJT2G
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NCP137AFCTCADJT2G Details

  • Manufacturer Part Number:

    NCP137AFCTCADJT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2016-07-26

  • Manufacturer:

    onsemi

  • YTEOL:

    9.4

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.06 V

  • Dropout Voltage1-Nom:

    0.04 V

  • Input-Output Voltage Differential-Max:

    4.5 V

  • Input-Output Voltage Differential-Min:

    0.3 V

  • JESD-30 Code:

    R-PBGA-B6

  • Length:

    1.2 mm

  • Line Regulation-Max (%/V):

    0.01

  • Load Regulation-Max:

    0.19%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.7 A

  • Output Voltage1-Max:

    5 V

  • Output Voltage1-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.8 mm

NCP137AFCTCADJT2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal resistance.
  • The critical timing parameters for the NCP137AFCTCADJT2G include the switching frequency, rise and fall times, and the dead time. These parameters are critical to ensure proper operation and to prevent issues such as shoot-through or cross-conduction.
  • When selecting external components for the NCP137AFCTCADJT2G, consider the operating frequency, voltage, and current requirements. Choose components with suitable voltage and current ratings, and ensure that they meet the required specifications for the application.
  • To ensure EMI and EMC compliance, consider the layout and routing of the PCB, use shielding and filtering as necessary, and ensure that the device is properly decoupled. Additionally, follow the recommended layout and routing guidelines to minimize radiation and susceptibility.

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