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NCP1380DDR2G - onsemi

Description: Quasi-resonant peak current mode control operation; Valley switching operation with valley lockout; Frequency foldback at light load; Adjustable overpower protection; Auto-recovery or latched internal output short circuit protection; Fixed internal 80 ms timer for short circuit protection; Combined overvoltage and overtemperature protection (A and B versions); Combined overvoltage protection and brownout (C and D versions); VCC range operation up to 28 V

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NCP1380DDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCP1380DDR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCP1380DDR2G Details

  • Manufacturer Part Number:

    NCP1380DDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8 Narrow Body-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    9.4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    65 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1380DDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1380DDR2G involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-frequency switching node (SW pin) away from sensitive analog circuits. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating. For output capacitors, choose ones with low ESR and high capacitance. The recommended input capacitor value is 10uF to 22uF, and the recommended output capacitor value is 22uF to 47uF.
  • The maximum ambient temperature range for the NCP1380DDR2G is -40°C to 125°C. However, the device can operate up to 150°C with derating.
  • To ensure stability, make sure the input and output capacitors are properly selected, the PCB layout is well-designed, and the device is operated within the recommended operating conditions. Additionally, a minimum of 10uF input capacitance and a maximum of 47uF output capacitance are recommended to prevent oscillation.
  • The recommended input voltage range for the NCP1380DDR2G is 2.7V to 5.5V. Operating the device outside this range may affect its performance and reliability.

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NCP1380DDR2G Overview

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