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NCP1399AADR2G - onsemi

Description: Current Mode Control Scheme; High−Frequency Operation from 20 kHz up to 750 kHz; Automatic Dead−time with Maximum Dead−time Clamp

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NCP1399AADR2G - onsemi - PCB symbol
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NCP1399AADR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 NB2
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NCP1399AADR2G - onsemi - 3D model - Small Outline Packages - SOIC−16 NB2
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NCP1399AADR2G Details

  • Manufacturer Part Number:

    NCP1399AADR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-16 NB

  • Package Description:

    SOIC-16

  • Manufacturer Package Code:

    751DU

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Min:

    10 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    7 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    750 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1399AADR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1399AADR2G involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the high-current paths. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the NCP1399AADR2G operates within its SOA, use a soft-start circuit to limit the inrush current during startup, and add a shutdown circuit to slowly discharge the output capacitors during shutdown. Monitor the input voltage and current to prevent overvoltage and overcurrent conditions.
  • A low-ESR ceramic or film capacitor with a value of 10-22uF is recommended for the input capacitor. The capacitor should be rated for the maximum input voltage and have a low impedance at the switching frequency.
  • Optimize the output filter design by selecting the right output capacitor value and type, and adding a small series resistor to dampen the output filter. Use a low-ESR capacitor with a value of 10-47uF and a series resistor of 1-10 ohms.
  • A good thermal management strategy for the NCP1399AADR2G involves using a heat sink with a thermal resistance of less than 10°C/W, applying a thermal interface material, and ensuring good airflow around the device. Keep the ambient temperature below 85°C and ensure the device is not exposed to high humidity.

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NCP1399AADR2G Overview

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