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NCP139AFCT120T2G - onsemi

Description: Ultra-Low Dropout of Typ. 40mV; Adjustable Voltage version; 50 mV typical dropout at the full 1 A load.; Guaranteed Output Current from 0 to 1 A; 0.5% Typical Output Voltage Accuracy; Output Current in Excess of 1 A; Output Active Discharge option available

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PCB Footprints
NCP139AFCT120T2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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3D Models
NCP139AFCT120T2G - onsemi  - 3D model - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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NCP139AFCT120T2G Details

  • Manufacturer Part Number:

    NCP139AFCT120T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.08 V

  • Dropout Voltage1-Nom:

    0.05 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.28 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Line Regulation-Max:

    0.0005064%

  • Load Regulation-Max:

    0.002%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    1.212 V

  • Output Voltage1-Min:

    1.188 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1%

  • Width:

    0.8 mm

NCP139AFCT120T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • Using a different inductor value than recommended can affect the converter's performance, stability, and efficiency. A smaller inductor value may result in higher ripple current and reduced efficiency, while a larger value may lead to increased size and cost. It's essential to consult the datasheet and application notes for guidance on inductor selection.
  • To troubleshoot issues with the device's soft-start feature, check the soft-start capacitor value and ensure it's within the recommended range. Verify that the soft-start pin is properly connected and not shorted to any other pin. Also, check the input voltage and ensure it's within the specified range. If issues persist, consult the datasheet and application notes for further guidance.
  • To mitigate EMI issues with the NCP139AFCT120T2G, use a shielded inductor, place the device and inductor close together, and use a common-mode choke. Additionally, ensure good PCB layout practices, such as keeping the power traces short and away from sensitive nodes, and using a solid ground plane. Consult the datasheet and application notes for more detailed guidance.

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