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NCP139AFCT180T2G - onsemi

Description: LDO Regulator with Bias Rail and Very Low Dropout, 1 A 1.8V Output Active Discharge

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NCP139AFCT180T2G - onsemi - PCB symbol
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PCB Footprints
NCP139AFCT180T2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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NCP139AFCT180T2G - onsemi - 3D model - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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NCP139AFCT180T2G Details

  • Manufacturer Part Number:

    NCP139AFCT180T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Manufacturer Package Code:

    567MV

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.08 V

  • Dropout Voltage1-Nom:

    0.05 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.88 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Line Regulation-Max:

    0.0006516%

  • Load Regulation-Max:

    0.002%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    1.818 V

  • Output Voltage1-Min:

    1.782 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    1%

  • Width:

    0.8 mm

NCP139AFCT180T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Additionally, derating the device's power dissipation according to the ambient temperature can help to prevent overheating.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To calculate the power dissipation of the device, you need to consider the input voltage, output voltage, output current, and switching frequency. You can use the equations provided in the datasheet or consult with an application engineer for guidance. Additionally, using a thermal simulation tool can help to estimate the device's power dissipation and junction temperature.
  • The recommended EMI mitigation techniques for this device include using a shielded layout, placing the device away from noise-sensitive components, using a common-mode choke, and adding EMI filters to the input and output lines. Additionally, following proper PCB layout and routing guidelines can help to reduce EMI emissions.

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NCP139AFCT180T2G Overview

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