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NCP148AFCT250T2G - onsemi

Description: Ultra High PSRR 90dB at 1kHz, 20mA; Ultra Low Output Noise 10µVRMS; Very Low Dropout 80mV@250mA ; Operating Input Voltage Range 1.9V to 5.5V; Ultra Low Quiescent current 18µA; Available in CSP4 0.35P package; Soft-start with optimized slew rate

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PCB Footprints
NCP148AFCT250T2G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A
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NCP148AFCT250T2G - onsemi  - 3D model - BGA - WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A
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NCP148AFCT250T2G Details

  • Manufacturer Part Number:

    NCP148AFCT250T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567JZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.315 V

  • Dropout Voltage1-Nom:

    0.19 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.5 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.001%

  • Load Regulation-Max:

    0.011225%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.45 A

  • Output Voltage1-Max:

    2.55 V

  • Output Voltage1-Min:

    2.45 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP148AFCT250T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature and implement over-temperature protection.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • The selection of input and output capacitors depends on the specific application requirements, such as the input voltage, output voltage, and desired ripple performance. A general guideline is to use low-ESR capacitors with a minimum capacitance of 10uF for the input and output. Consult the datasheet and application notes for more detailed guidance.
  • To minimize EMI and EMC issues, it is recommended to follow proper PCB layout and design guidelines, use shielding and filtering components as necessary, and ensure that the device is operated within the recommended frequency range. Consult the datasheet and application notes for more detailed guidance.

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NCP148AFCT250T2G Overview

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