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NCP148AFCT280T2G - onsemi

Description: Ultra High PSRR 90dB at 1kHz, 20mA; Ultra Low Output Noise 10µVRMS; Very Low Dropout 80mV@250mA ; Operating Input Voltage Range 1.9V to 5.5V; Ultra Low Quiescent current 18µA; Available in CSP4 0.35P package; Soft-start with optimized slew rate

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PCB Footprints
NCP148AFCT280T2G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A
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NCP148AFCT280T2G - onsemi  - 3D model - BGA - WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A
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NCP148AFCT280T2G Details

  • Manufacturer Part Number:

    NCP148AFCT280T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Package Description:

    WLCSP-4

  • Manufacturer Package Code:

    567JZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.29 V

  • Dropout Voltage1-Nom:

    0.175 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.000952%

  • Load Regulation-Max:

    0.012572%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.45 A

  • Output Voltage1-Max:

    2.856 V

  • Output Voltage1-Min:

    2.744 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP148AFCT280T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the copper traces wide and short can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Additionally, derating the device's power dissipation according to the ambient temperature can help to prevent overheating.
  • The high current capability of the NCP148AFCT280T2G requires careful consideration of PCB design, including the use of thick copper traces, adequate spacing between traces, and robust vias to handle the high current. Additionally, the PCB material and construction should be able to withstand the high current and thermal stresses.
  • The selection of input and output capacitors depends on the specific application requirements, including the input voltage, output voltage, and switching frequency. In general, low-ESR capacitors with high ripple current ratings are recommended. The datasheet provides guidelines for capacitor selection, and additional resources such as application notes and simulation tools can be used to optimize the design.
  • Potential sources of noise and EMI in the NCP148AFCT280T2G include the switching frequency, layout, and component selection. To mitigate these effects, it's essential to follow proper layout and grounding techniques, use shielding and filtering components, and ensure that the device is operated within its specified frequency range. Additionally, using a spread-spectrum clock or frequency dithering can help to reduce EMI.

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NCP148AFCT280T2G Overview

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