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NCP156ABFCT120280T2G - onsemi

Description: Low Quiescent Current Typ. 100 uA; Output voltage slew rate control; Very Low Dropout Voltage 140 mV at 500 mA; Ultra Low Noise Typ. 6.5 uVRMS on OUT2; Available in CSP6 1.2 mm x 0.8 mm; N-MOS and P-MOS dual LDO

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NCP156ABFCT120280T2G - onsemi - PCB symbol
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PCB Footprints
NCP156ABFCT120280T2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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3D Models
NCP156ABFCT120280T2G - onsemi - 3D model - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE B
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NCP156ABFCT120280T2G Details

  • Manufacturer Part Number:

    NCP156ABFCT120280T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.07 V

  • Dropout Voltage2-Max:

    0.16 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.5 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Load Regulation-Max:

    0.005%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Current2-Max:

    0.25 A

  • Output Voltage1-Max:

    1.218 V

  • Output Voltage1-Min:

    1.182 V

  • Output Voltage1-Nom:

    1.2 V

  • Output Voltage2-Max:

    2.856 V

  • Output Voltage2-Min:

    2.744 V

  • Output Voltage2-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.8 mm

NCP156ABFCT120280T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A 4-layer PCB with a solid ground plane and a thermal relief pattern around the thermal pad is also recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and airflow management. Additionally, derating the device's power rating and monitoring its junction temperature can help prevent overheating.
  • Using a different inductor value than recommended can affect the device's performance, including its efficiency, output voltage ripple, and stability. A smaller inductor value may result in higher output voltage ripple, while a larger value may lead to reduced efficiency and increased cost.
  • To troubleshoot issues with the device's soft-start feature, check the soft-start capacitor value and ensure it is within the recommended range. Also, verify that the soft-start pin is properly connected and not shorted to ground or other pins. If issues persist, consult the device's application note or contact onsemi support for further assistance.
  • To mitigate EMI issues with the NCP156ABFCT120280T2G, use a shielded inductor, place the device and its associated components in a quiet zone on the PCB, and ensure good decoupling and filtering of the input and output lines. Additionally, consider using EMI-absorbing materials and following good PCB layout practices.

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NCP156ABFCT120280T2G Overview

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