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NCP1602BEASNT1G - onsemi

Description: Last Shipments - Power Factor Controller, Enhanced Light Load Efficiency

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PCB Footprints
NCP1602BEASNT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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NCP1602BEASNT1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE V
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NCP1602BEASNT1G Details

  • Manufacturer Part Number:

    NCP1602BEASNT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Manufacturer Package Code:

    318G-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-11

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    9.5 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    3 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    50 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCP1602BEASNT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power rating according to the temperature derating curve provided in the datasheet.
  • The recommended input capacitors are low-ESR ceramic capacitors with a value of 10uF to 22uF, and the recommended output capacitors are low-ESR ceramic capacitors with a value of 22uF to 47uF. The capacitor selection should be based on the specific application requirements and the device's operating frequency.
  • To troubleshoot issues with the device's enable pin, check the enable pin's voltage level, ensure it's within the recommended range, and verify that it's not being pulled low by any external circuitry. Also, check the device's shutdown mode and ensure it's not being triggered inadvertently.
  • Operating the device beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within its recommended voltage, current, and temperature ranges to guarantee reliable operation.

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NCP1602BEASNT1G Overview

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