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NCP160AFCS300T2G - onsemi

Description: Very Low Dropout 80mV at 250mA; Ultra High PSRR 98dB at 1kHz, 48dB at 100kHz; Ultra Low Output Noise 10 µVRMS; Operating Input Voltage Range 1.9V to 5.5V; Available in CSP4 0.35P and XDFN4 0.65P packages; Ultra Low Quiescent current 18 µA

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NCP160AFCS300T2G - onsemi - PCB symbol
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PCB Footprints
NCP160AFCS300T2G - onsemi PCB footprint - BGA - BGA - WLCSP4 CASE 567KA
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3D Models
NCP160AFCS300T2G - onsemi - 3D model - BGA - WLCSP4 CASE 567KA
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NCP160AFCS300T2G Details

  • Manufacturer Part Number:

    NCP160AFCS300T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567KA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.155 V

  • Dropout Voltage1-Nom:

    0.09 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    3.06 V

  • Output Voltage1-Min:

    2.94 V

  • Output Voltage1-Nom:

    3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.45 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP160AFCS300T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the copper traces as short and wide as possible to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power rating and using a heat sink if necessary.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the specified voltage, current, and temperature ranges to guarantee reliable operation.
  • To troubleshoot issues related to the device's overcurrent protection feature, check the input voltage, output current, and temperature to ensure they are within the specified ranges. Verify that the device is properly connected and that the PCB layout is correct. If the issue persists, consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • The NCP160AFCS300T2G is designed to meet EMI and EMC standards, but it's still essential to follow proper PCB layout and design practices to minimize electromagnetic interference. Use shielding, filtering, and grounding techniques as necessary to ensure compliance with relevant EMI and EMC regulations.

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NCP160AFCS300T2G Overview

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