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NCP160AFCT180T2G - onsemi

Description: Very Low Dropout 80mV at 250mA; Ultra High PSRR 98dB at 1kHz, 48dB at 100kHz; Ultra Low Output Noise 10 µVRMS; Operating Input Voltage Range 1.9V to 5.5V; Available in CSP4 0.35P and XDFN4 0.65P packages; Ultra Low Quiescent current 18 µA

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NCP160AFCT180T2G - onsemi - PCB symbol
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NCP160AFCT180T2G - onsemi PCB footprint - BGA - BGA - WLCSP4-CASE567JZ
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NCP160AFCT180T2G - onsemi - 3D model - BGA - WLCSP4-CASE567JZ
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NCP160AFCT180T2G Details

  • Manufacturer Part Number:

    NCP160AFCT180T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567JZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.18 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP160AFCT180T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The NCP160AFCT180T2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and handling to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • To troubleshoot issues with output voltage regulation, check the input voltage, output load, and feedback network. Ensure that the device is properly configured, and the feedback resistors are correctly selected. Also, verify that the device is not overheating or experiencing excessive voltage stress.
  • When paralleling multiple devices, ensure that each device has its own independent feedback network, and that the devices are properly synchronized to prevent oscillations. Also, consider the current sharing and thermal management implications of paralleling devices.

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NCP160AFCT180T2G Overview

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