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NCP1612BDR2G - onsemi

Description: Obsolete - Power Factor Controller, High Voltage, Active X2

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NCP1612BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−10 NB CASE 751BQ ISSUE B
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NCP1612BDR2G - onsemi  - 3D model - Small Outline Packages - SOIC−10 NB CASE 751BQ ISSUE B
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NCP1612BDR2G Details

  • Manufacturer Part Number:

    NCP1612BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-10 NB

  • Package Description:

    SOIC-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    751BQ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    35 V

  • Input Voltage-Min:

    9.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP10,.25,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Current-Max (Isup):

    3 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    50 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1612BDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1612BDR2G should include a solid ground plane, separate analog and digital grounds, and a decoupling capacitor (e.g., 10uF) between VIN and GND. Additionally, keep the input and output capacitors close to the IC and use short, wide traces for the power lines.
  • Choose X5R or X7R ceramic capacitors with a voltage rating of at least 2x the input voltage. For the input capacitor, a value of 4.7uF to 10uF is recommended. For the output capacitor, a value of 10uF to 22uF is recommended. Ensure the capacitors are placed close to the IC and have a low ESR.
  • The NCP1612BDR2G is rated for operation from -40°C to +125°C. However, the maximum ambient temperature range depends on the specific application and the device's power dissipation. Consult the datasheet and thermal management guidelines for more information.
  • To ensure stability, follow the recommended PCB layout, use a sufficient output capacitor, and ensure the input voltage is within the recommended range. Additionally, avoid using long, thin traces for the power lines, and keep the feedback loop as short as possible.
  • The NCP1612BDR2G is capable of delivering up to 2A of output current. However, the actual output current capability depends on the input voltage, output voltage, and ambient temperature. Consult the datasheet for more information on output current capability and thermal derating.

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