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NCP163AFCT180T2G - onsemi

Description: Ultra Low Quiescent current 12 µA; Very Low Dropout 80mV at 250mA; Ultra Low Output Noise 6.5 µVRMS; Operating Input Voltage Range 2.2V to 5.5V ; Available in 0.64mm x 0.64 mm CSP4 0.35P and 1mm x 1mm XDFN4 0.65P Packages; Ultra High PSRR 92dB at 1 kHz, 60dB at 100 kHz; Available in TSOP5 Package

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NCP163AFCT180T2G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.64x0.64_
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NCP163AFCT180T2G - onsemi  - 3D model - BGA - WLCSP4, 0.64x0.64_
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NCP163AFCT180T2G Details

  • Manufacturer Part Number:

    NCP163AFCT180T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567JZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.18 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.2 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.001188%

  • Load Regulation-Max:

    0.06723%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP163AFCT180T2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The critical timing parameters include the input rise and fall times, output delay, and propagation delay. These parameters are critical for ensuring reliable operation and should be carefully considered during design and layout.
  • The device has built-in ESD protection, but additional protection measures may be necessary depending on the application. Consider using external ESD protection devices or implementing ESD protection in the PCB design.
  • The recommended decoupling capacitor values are 10nF to 100nF, and they should be placed as close as possible to the device pins. The capacitors should be rated for the operating voltage and should have a low equivalent series resistance (ESR).

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