A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad connected to the ground plane.
To ensure reliable start-up and shutdown, ensure that the input voltage rises and falls monotonically, and that the input voltage is within the recommended operating range. Also, ensure that the output capacitor is properly sized and placed close to the device to minimize parasitic inductance.
When selecting the output capacitor, consider the output voltage ripple, output current, and equivalent series resistance (ESR). A low-ESR capacitor with a high ripple current rating is recommended. The output capacitor should be placed close to the device to minimize parasitic inductance.
To minimize EMI, use a shielded inductor, keep the device and inductor close together, and use a common-mode choke or ferrite bead on the input lines. Also, ensure good PCB layout practices, such as keeping signal traces short and away from noise sources.
The device has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking airflow around the device, and ensure that the PCB is designed to dissipate heat efficiently.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NCP164ASNADJT1G Overview
Use the download button to access the NCP164ASNADJT1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCP16,
or try a keyword search, such as Linear Regulator ICs
