A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
To ensure reliable start-up and shutdown, ensure that the input voltage rises and falls monotonically, and that the input voltage is within the recommended operating range. Also, ensure that the output capacitor is properly sized and placed close to the device to minimize parasitic inductance.
When selecting the output capacitor, consider the output voltage ripple, output current, and equivalent series resistance (ESR). A low-ESR capacitor with a high ripple current rating is recommended. The output capacitor should also be placed close to the device to minimize parasitic inductance.
To minimize EMI, use a shielded inductor, keep the device and inductor close together, and use a common-mode choke or ferrite bead on the input lines. Also, ensure good PCB layout practices, such as keeping signal lines short and away from noise sources.
Thermal design considerations include ensuring good airflow around the device, using a heat sink if necessary, and keeping the device away from other heat sources. The device's thermal pad should be connected to a solid ground plane or a thermal pad on the PCB.
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NCP164CSNADJT1G Overview
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