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NCP1681AAD2R2G - onsemi

Description: Totem Pole PFC Topology Eliminates Input Diode Bridge; Continuous Conduction Mode (CCM) Operation At High Power Level; Optional Multi-mode Operation With CCM at High Power & CrM at Medium Power Level; Frequency Foldback in DCM With 25 kHz Minimum Frequency; Skip Mode in Very Light Load Condition; Novel Current Sense Scheme; Digital Voltage Loop Compensation; AC Line Monitoring Circuit & AC Phase Detection; Near Unity Power Factor in All Operating Modes; PFC OK Indicator

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NCP1681AAD2R2G - onsemi PCB footprint - Other - Other - SOIC20 NB LESS PIN 17 & 19 CASE 751EZ
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NCP1681AAD2R2G - onsemi  - 3D model - Other - SOIC20 NB LESS PIN 17 & 19 CASE 751EZ
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NCP1681AAD2R2G Details

  • Manufacturer Part Number:

    NCP1681AAD2R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC20 NB LESS PIN 17 & 19

  • Package Description:

    SOIC-20

  • Manufacturer Package Code:

    751EZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Min:

    9.4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    69.6 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1681AAD2R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure reliable startup and shutdown of the NCP1681AAD2R2G, it is recommended to follow a soft-start sequence, where the input voltage is ramped up slowly to prevent inrush currents. Additionally, a capacitor should be placed between the VIN and GND pins to filter out noise and ensure a clean startup.
  • The maximum allowed input voltage ripple for the NCP1681AAD2R2G is 10% of the nominal input voltage. Exceeding this limit may affect the device's performance and reliability.
  • The NCP1681AAD2R2G is rated for operation up to 125°C, but it is recommended to derate the output current and input voltage to ensure reliable operation at high temperatures. Additionally, the device should be mounted on a heat sink to dissipate heat efficiently.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output current, and feedback resistors for any errors or misconfigurations. Also, ensure that the device is properly decoupled and that the output capacitor is of sufficient value and type.

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