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NCP1681BAD2R2G - onsemi

Description: PFC IC Continuous Conduction (CCM) 65kHz 20-SOIC , 30V , 65kHz , 300mV , -40C ~ +125C

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NCP1681BAD2R2G - onsemi PCB footprint - Other - Other - SOIC20 NB LESS PIN 17 & 19 CASE 751EZ ISSUE O
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NCP1681BAD2R2G - onsemi  - 3D model - Other - SOIC20 NB LESS PIN 17 & 19 CASE 751EZ ISSUE O
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NCP1681BAD2R2G Details

  • Manufacturer Part Number:

    NCP1681BAD2R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC20 NB LESS PIN 17 & 19

  • Package Description:

    SOIC-20

  • Manufacturer Package Code:

    751EZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Min:

    9.4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    69.6 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1681BAD2R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure reliable start-up of the converter, it is recommended to add a soft-start circuit to limit the inrush current during start-up, and to use a sufficient input capacitance to filter out noise and voltage transients. Additionally, the input voltage should be ramped up slowly to prevent excessive inrush current.
  • The maximum allowed output capacitance for stable operation depends on the specific application and operating conditions. As a general rule, the output capacitance should be limited to 10uF to 22uF to prevent oscillations and ensure stable operation. However, it is recommended to consult the application note and perform stability analysis to determine the optimal output capacitance for the specific design.
  • To troubleshoot oscillations or instability issues in the converter, it is recommended to check the PCB layout for any potential noise coupling or resonance issues, and to verify that the input and output capacitors are properly selected and placed. Additionally, the loop gain and phase margin should be analyzed to identify any potential stability issues, and the compensation network should be adjusted accordingly.
  • The recommended input filter configuration to minimize EMI emissions involves using a pi-filter (C-L-C) or a T-filter (L-C-L) with a common-mode choke and X-capacitors. The filter components should be selected based on the specific application and operating frequency, and the filter should be placed as close to the input pins as possible to minimize radiation.

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NCP1681BAD2R2G Overview

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